Assembly
SMT – 4 high speed manufacturing lines consisting of 1 x QUAD QSA-30 chip shooter & 3 x Samsung CP45FV placement machines and 3 x CP45FV NEO and 1 x CP40CV prototype and small batch line, all with µBGA capability.
Paste and glue dispensing – 4 off temperature controlled SmTech AVX400 automated and 2 off SmTech 100 MV.
Reflow ovens consisting of Vitronics Unitherm SMR – 800, BTU VIP 98 and 2 off BTU Pyramex 98.
Flow soldering is provided by Blundell CMS400D dual wave models and CMS400LF (Lead Free) .
PCB cleaning by a Kerry Microsolve 450/2 CO-Solvent fully automated system.
Blundell SC800 stencil cleaner.
Pillarhouse ‘Ruby2’ allows flow soldering of selected pcb areas.
2 off Blundell Cropmatics.
Moisture control-Boss Vacuum Packing and Sealing Machine.
2 off Contax CS-400C cut and clinch machines.
Berg pinning machine.
Inspection
AOI systems – Diagnosys ‘ Visionpoint’ and Photon Dynamics Supervision 7550 Colour.
Mirtec benchtop AOI with SPC data collection x 4
Piergiacomi ‘Xbim 50’ BGA X-Ray inspection
Ersascope 2 plus µBGA and flip chip capable. Ersascope 3000.
Vision ‘Mantis’ inspection viewers
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Inspection
AOI systems – Diagnosys ‘ Visionpoint’ and Photon Dynamics Supervision 7550 Colour.
Mirtec benchtop AOI with SPC data collection x 4
Piergiacomi ‘Xbim 50’ BGA X-Ray inspection
Ersascope 2 plus µBGA and flip chip capable. Ersascope 3000.
Vision ‘Mantis’ inspection viewers
Additional Services
PVA2000 fully automated conformal coating system
ERSA IR550A – BGA, CSP & fine pitch rework station
Planer SR7-05 integrated rework station
Universal IC programmer and test systems
Additional Services
PVA2000 fully automated conformal coating system
ERSA IR550A – BGA, CSP & fine pitch rework station
Planer SR7-05 integrated rework station
Universal IC programmer and test systems |